Dr. Hu is a technical specialist in the firm's Electronics Group. He is involved in patent preparation, prosecution and litigation before the Patent Trial and Appeal Board (PTAB). His technical areas include semiconductor devices and fabrication, semiconductor process and integration, material science and engineering, device and material characterization, nanotechnology, chemical sensor and bimolecular sensor, thin films, carbon nanotubes and graphene, signal processing, and optical communication.
Prior to joining Sterne, Kessler, Goldstein, and Fox, Dr. Hu was a Senior Process Integration Engineer in the R&D center at Micron Technology at Boise, Idaho. His work included developing the cell integration and cell materials for the next generation 3D NAND devices. Dr. Hu also worked as a Process Development Engineer before his role in Process Integration. His work focused on thin films development for different memory devices, including DRAM, NAND, Emerging memory and 3D X-point memory. Dr. Hu won 2015 Micron's Best Paper Award for his work in 3D NAND.
Dr. Hu's Ph.D. work focused on fabrication of sensor arrays for chemical and biomolecular materials. Dr. Hu developed and fabricated nanowire sensor array based on metals, conducting polymers, and metal oxides. Dr. Hu also worked on new memory devices including Resistive RAM using graphene.
Ph.D. Electrical Engineering, University of Pittsburgh
M.S. Electrical Engineering, University of Pittsburgh
B.S Microelectronics, Fudan University
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